{"product_id":"9780367573669","title":"Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging","description":"\u003cp\u003eModeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power\u003c\/p\u003e","brand":"CRC Press","offers":[{"title":"Default Title","offer_id":48697378013419,"sku":"00000_00000_00000_00000","price":122.67,"currency_code":"SGD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0758\/4484\/5803\/files\/9780367573669-1.jpg?v=1781618034","url":"https:\/\/kinokuniya.com.sg\/ja\/products\/9780367573669","provider":"Books Kinokuniya Singapore","version":"1.0","type":"link"}