{"product_id":"9781493915552","title":"Wafer-Level Chip-Scale Packaging : Analog and Power Semiconductor Applications","description":"\u003cp\u003eAnalog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.\u003c\/p\u003e","brand":"Springer","offers":[{"title":"Default Title","offer_id":48938332487915,"sku":"00000_00000_00000_00000","price":327.78,"currency_code":"SGD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0758\/4484\/5803\/files\/9781493915552-1.jpg?v=1783112010","url":"https:\/\/kinokuniya.com.sg\/ja\/products\/9781493915552","provider":"Books Kinokuniya Singapore","version":"1.0","type":"link"}