{"product_id":"9780367574543","title":"Through Silicon Vias : Materials, Models, Design, and Performance","description":"\u003cp\u003eRecent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph\u003c\/p\u003e","brand":"CRC Press","offers":[{"title":"Default Title","offer_id":48697380012267,"sku":"00000_00000_00000_00000","price":133.65,"currency_code":"SGD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0758\/4484\/5803\/files\/9780367574543-1.jpg?v=1781618036","url":"https:\/\/kinokuniya.com.sg\/products\/9780367574543","provider":"Books Kinokuniya Singapore","version":"1.0","type":"link"}