{"product_id":"9780471574811","title":"Semiconductor Wafer Bonding : Science and Technology (The Electrochemical Society Series)","description":"\u003cp\u003eThough there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.\u003c\/p\u003e","brand":"Wiley-Interscience","offers":[{"title":"Default Title","offer_id":48676348002539,"sku":"00000_00000_00000_00000","price":366.14,"currency_code":"SGD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0758\/4484\/5803\/files\/9780471574811-1.jpg?v=1781624492","url":"https:\/\/kinokuniya.com.sg\/products\/9780471574811","provider":"Books Kinokuniya Singapore","version":"1.0","type":"link"}