{"product_id":"9781138075405","title":"Semiconductor Packaging : Materials Interaction and Reliability","description":"\u003cp\u003eThis easy-to-read book enables a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.\u003c\/p\u003e","brand":"CRC Press","offers":[{"title":"Default Title","offer_id":48729343754475,"sku":"00000_00000_00000_00000","price":194.08,"currency_code":"SGD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0758\/4484\/5803\/files\/9781138075405-1.jpg?v=1781656989","url":"https:\/\/kinokuniya.com.sg\/products\/9781138075405","provider":"Books Kinokuniya Singapore","version":"1.0","type":"link"}