{"product_id":"9781785619076","title":"SiC Power Module Design : Performance, robustness and reliability (Energy Engineering)","description":"\u003cp\u003eHigh-frequency switching power semiconductor devices are at the heart of power electronic converters. To date, these devices have been dominated by the well-established silicon (Si) technology. However, their intrinsic physical limits are becoming a barrier to achieving higher performance power conversion. Wide Bandgap (WBG) semiconductor devices offer the potential for higher efficiency, smaller size, lighter weight, and\/or longer lifetime. Applications in power grid electronics as well as in electromobility are on the rise, but a number of technological bottle-necks need to be overcome if applications are to become more widespread - particularly packaging. This book describes the development of advanced multi-chip packaging solutions for novel WBG semiconductors, specifically silicon carbide (SiC) power MOSFETs. Coverage includes an introduction; multi-chip power modules; module design and transfer to SiC technology; electrothermal, thermo-mechanical, statistical and electromagnetic aspects of optimum module design; high temperature capable SiC power modules; validation technologies; degradation monitoring; and emerging packaging technologies. The book is a valuable reference for researchers and experts in academia and industry.\u003c\/p\u003e","brand":"Institution of Engineering and Technology","offers":[{"title":"Default Title","offer_id":48842177904875,"sku":"00000_00000_00000_00000","price":292.99,"currency_code":"SGD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0758\/4484\/5803\/files\/9781785619076-1.jpg?v=1781703249","url":"https:\/\/kinokuniya.com.sg\/products\/9781785619076","provider":"Books Kinokuniya Singapore","version":"1.0","type":"link"}