{"product_id":"9789814740203","title":"Co-design and Modelling for Advanced Integration and Packaging: Manufacturing and Reliability (Wspc Series in Advanced Integration and Packaging)","description":"\u003cp\u003eThe aim of this book is to provide readers with an in-depth understanding of current state-of-the-art in the use of co-design and modeling tools to predict reliability and robustness of advanced packaging and integration technologies for both micro and power electronic systems.\u003c\/p\u003e","brand":"World Scientific Publishing Co Pte Ltd","offers":[{"title":"Default Title","offer_id":48266842013931,"sku":"00000_00000_00000_00000","price":252.7,"currency_code":"SGD","in_stock":false}],"url":"https:\/\/kinokuniya.com.sg\/products\/9789814740203","provider":"Books Kinokuniya Singapore","version":"1.0","type":"link"}