Area Array Packaging Processes

259.93 SGD
会員価格
233.94
English

Product Description

This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

Available to Order

Usually dispatches within 3-4 weeks

While every attempt has been made to ensure stock availability, occasionally we may run out of stock at our stores.

ご注文金額 50.00SGD以上で国内送料無料

Discount is applied at checkout.

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