ページに戻る

ズーム ロールオーバーで画像拡大

Thermal Stress and Strain in Microelectronics Packaging (Reprint)

Lau, John (EDT)
311.28 SGD
会員価格
280.16
English

Product Description

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications.

... Read Full Text

Available to Order

Usually dispatches within 3-4 weeks

While every attempt has been made to ensure stock availability, occasionally we may run out of stock at our stores.

ご注文金額 50.00SGD以上で国内送料無料

Discount is applied at checkout.

Recently Viewed Items

Related Products