Materials for Information Technology : Devices, Interconnects and Packaging (Engineering Materials and Processes)

Name: Materials for Information Technology : Devices, Interconnects and Packaging (Engineering Materials and Processes)
Brand: SPRINGER, BERLIN
SKU: 00000_00000_00000_00000
Price: 402.84 SGD
Availability: InStock

Zschech, Ehrenfried (EDT)/ Whelan, Caroline (EDT)

402.84 SGD

Member Price

362.56

English

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Publisher

SPRINGER, BERLIN

Publication Date

Sep 2005

ISBN

9781852339418

Pages

338 illus./528

Item Type

Book

Format

Hardcover

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Materials for Information Technology : Devices, Interconnects and Packaging (Engineering Materials and Processes)

Available to Order

Materials for Information Technology : Devices, Interconnects and Packaging (Engineering Materials and Processes)

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